Dr Rajnish Sharma Joins as Secretary of IEEE, Delhi Section
Dr. Rajnish Sharma, Dean, Research & Academics, joint secretary Of IEEE, Delhi Section. Dr. Sharma has volunteered for various activities of IEEEin the past ten years and is well known in the IEEE circle with high regard and respect.
The Institute of Electrical and Electronics Engineers (IEEE) is a professional association for electronic and electrical engineering and its corporate office is located in New York City, United States of America. It is the world’s largest technical professional organization with more than 419,000 members worldwide and 4000 + members in the Delhi section.
Individuals, who by experience, give evidence of competence in an IEEE designated field become the member of this reputed institution. The designated spheres are Engineering, Computer Science and Information Technology, Physical Sciences, Biological and Medical Sciences, Mathematics, Technical Communications, Education, Management, and Law andPolicy.
Eligibility to become the Secretary Of IEEE, Delhi Section is that the candidate must be an IEEE member in good standing and should be of IEEE Senior Member grade or higher.
Dr. RajnishSharma, in accordance with his roles, shall be serving as a Corporate Officer of the IEEE, as a member of the IEEE Board of Directors and also will Chair the IEEE Governance Committee.
Two patents, “Improved Multilevel food tray” | Indian Patent Office Journal and “Circuit for Noise Mitigation”, have been filed in the name of Dr. Sharma. He has more than 50 research papers to his credit in international journals and conferences of repute. Besides this, he has got published one book titled “Solid State Electronic Devices” from OxfordUniversity Press to his credit. None the less, he has been on the reviewer’s panellist for many journals of international repute like AppliedPhysical Letters, Journal of Vacuum Science and Technology, Carbon, Journal ofNon- rystalline Solids Current Applied Physics and many other journals from publishers like IEEE, IET and Springer.
